Precision cutter

The Low Speed Diamond saw is well established in the materials laboratory for cutting and sectioning a wide variety of small and delicate samples particularly when the material structure is not homogeneous. It gives a high quality cut surface without serious deformation and with minimum burr. The universal design uses thin diamond/CBN bonded wafering blades to cut fragile and soft sample that cannot be handled by high speed abrasive/diamond cutting machines. A range of sample holders have been designed for this purpose including a rotating holder for round material. The speed of the wafering blades can vary between 50 and 1000rpm for optimum cutting conditions.